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	<title>Comments on: Electronics trends for 2018</title>
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	<link>https://www.epanorama.net/blog/2017/12/29/electronics-trends-for-2018-2/</link>
	<description>All about electronics and circuit design</description>
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		<title>By: Tomi Engdahl</title>
		<link>https://www.epanorama.net/blog/2017/12/29/electronics-trends-for-2018-2/comment-page-27/#comment-1624601</link>
		<dc:creator><![CDATA[Tomi Engdahl]]></dc:creator>
		<pubDate>Fri, 08 Feb 2019 11:44:35 +0000</pubDate>
		<guid isPermaLink="false">http://www.epanorama.net/newepa/?p=62280#comment-1624601</guid>
		<description><![CDATA[http://www.etn.fi/index.php/13-news/9034-samsung-osti-eniten-komponentteja]]></description>
		<content:encoded><![CDATA[<p><a href="http://www.etn.fi/index.php/13-news/9034-samsung-osti-eniten-komponentteja" rel="nofollow">http://www.etn.fi/index.php/13-news/9034-samsung-osti-eniten-komponentteja</a></p>
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	<item>
		<title>By: Tomi Engdahl</title>
		<link>https://www.epanorama.net/blog/2017/12/29/electronics-trends-for-2018-2/comment-page-27/#comment-1624589</link>
		<dc:creator><![CDATA[Tomi Engdahl]]></dc:creator>
		<pubDate>Fri, 08 Feb 2019 11:34:48 +0000</pubDate>
		<guid isPermaLink="false">http://www.epanorama.net/newepa/?p=62280#comment-1624589</guid>
		<description><![CDATA[http://www.etn.fi/index.php/13-news/9049-negatiivinen-kapasitanssi-osoitettiin-kokeellisesti]]></description>
		<content:encoded><![CDATA[<p><a href="http://www.etn.fi/index.php/13-news/9049-negatiivinen-kapasitanssi-osoitettiin-kokeellisesti" rel="nofollow">http://www.etn.fi/index.php/13-news/9049-negatiivinen-kapasitanssi-osoitettiin-kokeellisesti</a></p>
]]></content:encoded>
	</item>
	<item>
		<title>By: Tomi Engdahl</title>
		<link>https://www.epanorama.net/blog/2017/12/29/electronics-trends-for-2018-2/comment-page-27/#comment-1624559</link>
		<dc:creator><![CDATA[Tomi Engdahl]]></dc:creator>
		<pubDate>Fri, 08 Feb 2019 09:55:42 +0000</pubDate>
		<guid isPermaLink="false">http://www.epanorama.net/newepa/?p=62280#comment-1624559</guid>
		<description><![CDATA[Ruotsalaiset kehittivät oppivan transistorin 
http://www.etn.fi/index.php/13-news/9051-ruotsalaiset-kehittivat-oppivan-transistorin

Ruotsalaisen Linköpingin yliopiston tutkijat ovat kehittäneet orgaanisen transistorin, joka matkii aivojen toimintaa.]]></description>
		<content:encoded><![CDATA[<p>Ruotsalaiset kehittivät oppivan transistorin<br />
<a href="http://www.etn.fi/index.php/13-news/9051-ruotsalaiset-kehittivat-oppivan-transistorin" rel="nofollow">http://www.etn.fi/index.php/13-news/9051-ruotsalaiset-kehittivat-oppivan-transistorin</a></p>
<p>Ruotsalaisen Linköpingin yliopiston tutkijat ovat kehittäneet orgaanisen transistorin, joka matkii aivojen toimintaa.</p>
]]></content:encoded>
	</item>
	<item>
		<title>By: Tomi Engdahl</title>
		<link>https://www.epanorama.net/blog/2017/12/29/electronics-trends-for-2018-2/comment-page-27/#comment-1624513</link>
		<dc:creator><![CDATA[Tomi Engdahl]]></dc:creator>
		<pubDate>Fri, 08 Feb 2019 07:55:49 +0000</pubDate>
		<guid isPermaLink="false">http://www.epanorama.net/newepa/?p=62280#comment-1624513</guid>
		<description><![CDATA[PMBus-compatible PoL regulator for active power management
https://www.edn.com/design/power-management/4461499/PMBus-compatible-PoL-regulator-for-active-power-management

The need to optimize efficiency and address complex power requirements of high-end processors, FPGAs, and ASICs are making active power management a critical design requirement in data center servers, telecoms systems, and networking equipment applications. At the same time, engineers designing power schemes are expected to minimize board space while reducing the development time between the initial concept and the final product.
To address the challenges of active power management, engineers must now consider solutions built around the PMBus specification, which offers a platform for monitoring and controlling power management devices. To address space-constraint issues, solutions with a minimal number of components must be implemented. The MPQ8645P, the latest point-of-load (PoL) regulator with PMBus integration from Monolithic Power Systems (MPS), provides a way for engineers to meet both sets of system design challenges.]]></description>
		<content:encoded><![CDATA[<p>PMBus-compatible PoL regulator for active power management<br />
<a href="https://www.edn.com/design/power-management/4461499/PMBus-compatible-PoL-regulator-for-active-power-management" rel="nofollow">https://www.edn.com/design/power-management/4461499/PMBus-compatible-PoL-regulator-for-active-power-management</a></p>
<p>The need to optimize efficiency and address complex power requirements of high-end processors, FPGAs, and ASICs are making active power management a critical design requirement in data center servers, telecoms systems, and networking equipment applications. At the same time, engineers designing power schemes are expected to minimize board space while reducing the development time between the initial concept and the final product.<br />
To address the challenges of active power management, engineers must now consider solutions built around the PMBus specification, which offers a platform for monitoring and controlling power management devices. To address space-constraint issues, solutions with a minimal number of components must be implemented. The MPQ8645P, the latest point-of-load (PoL) regulator with PMBus integration from Monolithic Power Systems (MPS), provides a way for engineers to meet both sets of system design challenges.</p>
]]></content:encoded>
	</item>
	<item>
		<title>By: Tomi Engdahl</title>
		<link>https://www.epanorama.net/blog/2017/12/29/electronics-trends-for-2018-2/comment-page-27/#comment-1624507</link>
		<dc:creator><![CDATA[Tomi Engdahl]]></dc:creator>
		<pubDate>Fri, 08 Feb 2019 07:46:00 +0000</pubDate>
		<guid isPermaLink="false">http://www.epanorama.net/newepa/?p=62280#comment-1624507</guid>
		<description><![CDATA[VCSEL Technology Takes Off
https://semiengineering.com/vcsel-technology-takes-off/

iPhone X elevates niche optical technology to hot growth market. Now the question is what else it is good for?

Vertical cavity surface emitting laser (VCSEL) technology, a proven but mostly niche technology until recently, is suddenly a very hot commodity thanks to the introduction of facial recognition in phones and other mobile devices.

VCELS primarily have been used as a low-cost way of tracking movement and transfering data in computer mice, laser printers and in fiber optics. But Apple’s decision to use VCSEL technology for facial identification in its iPhone X has pushed this technology in a different direction. That decision—and the flood of smartphone and consumer electronics makers who followed suit—forced the whole VCSEL market to scale up with new fabrication, testing and validation processes.

“In the VCSEL market, nothing happened for years,”]]></description>
		<content:encoded><![CDATA[<p>VCSEL Technology Takes Off<br />
<a href="https://semiengineering.com/vcsel-technology-takes-off/" rel="nofollow">https://semiengineering.com/vcsel-technology-takes-off/</a></p>
<p>iPhone X elevates niche optical technology to hot growth market. Now the question is what else it is good for?</p>
<p>Vertical cavity surface emitting laser (VCSEL) technology, a proven but mostly niche technology until recently, is suddenly a very hot commodity thanks to the introduction of facial recognition in phones and other mobile devices.</p>
<p>VCELS primarily have been used as a low-cost way of tracking movement and transfering data in computer mice, laser printers and in fiber optics. But Apple’s decision to use VCSEL technology for facial identification in its iPhone X has pushed this technology in a different direction. That decision—and the flood of smartphone and consumer electronics makers who followed suit—forced the whole VCSEL market to scale up with new fabrication, testing and validation processes.</p>
<p>“In the VCSEL market, nothing happened for years,”</p>
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	</item>
	<item>
		<title>By: Tomi Engdahl</title>
		<link>https://www.epanorama.net/blog/2017/12/29/electronics-trends-for-2018-2/comment-page-27/#comment-1624506</link>
		<dc:creator><![CDATA[Tomi Engdahl]]></dc:creator>
		<pubDate>Fri, 08 Feb 2019 07:45:18 +0000</pubDate>
		<guid isPermaLink="false">http://www.epanorama.net/newepa/?p=62280#comment-1624506</guid>
		<description><![CDATA[The Race To Multi-Domain SoCs
https://semiengineering.com/the-race-to-multi-domain-socs/

Arteris IP’s CEO looks at how automotive and AI are altering chip design.]]></description>
		<content:encoded><![CDATA[<p>The Race To Multi-Domain SoCs<br />
<a href="https://semiengineering.com/the-race-to-multi-domain-socs/" rel="nofollow">https://semiengineering.com/the-race-to-multi-domain-socs/</a></p>
<p>Arteris IP’s CEO looks at how automotive and AI are altering chip design.</p>
]]></content:encoded>
	</item>
	<item>
		<title>By: Tomi Engdahl</title>
		<link>https://www.epanorama.net/blog/2017/12/29/electronics-trends-for-2018-2/comment-page-27/#comment-1624426</link>
		<dc:creator><![CDATA[Tomi Engdahl]]></dc:creator>
		<pubDate>Thu, 07 Feb 2019 13:08:08 +0000</pubDate>
		<guid isPermaLink="false">http://www.epanorama.net/newepa/?p=62280#comment-1624426</guid>
		<description><![CDATA[In-Memory Computing Challenges Come Into Focus
https://semiengineering.com/challenges-emerge-for-in-memory-computing/

Researchers digging into ways around the von Neumann bottleneck.]]></description>
		<content:encoded><![CDATA[<p>In-Memory Computing Challenges Come Into Focus<br />
<a href="https://semiengineering.com/challenges-emerge-for-in-memory-computing/" rel="nofollow">https://semiengineering.com/challenges-emerge-for-in-memory-computing/</a></p>
<p>Researchers digging into ways around the von Neumann bottleneck.</p>
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	</item>
	<item>
		<title>By: Tomi Engdahl</title>
		<link>https://www.epanorama.net/blog/2017/12/29/electronics-trends-for-2018-2/comment-page-27/#comment-1624340</link>
		<dc:creator><![CDATA[Tomi Engdahl]]></dc:creator>
		<pubDate>Wed, 06 Feb 2019 15:08:26 +0000</pubDate>
		<guid isPermaLink="false">http://www.epanorama.net/newepa/?p=62280#comment-1624340</guid>
		<description><![CDATA[Semiconductor Sales Increase 13.7% in 2018 
  
The Semiconductor Industry Association (SIA) announced the global semiconductor industry posted sales of $468.8 billion in 2018, the industry&#039;s highest-ever annual total and an increase of 13.7% compared to the 2017 total. Global sales for the month of December 2018 reached $38.2 billion, a slight increase of 0.6% over the December 2017 total, but down 7.0% compared to the total from ...

Global Semiconductor Sales Increase 13.7 Percent to $468.8 Billion in 2018
https://www.semiconductors.org/global-semiconductor-sales-increase-13-7-percent-to-468-8-billion-in-2018/]]></description>
		<content:encoded><![CDATA[<p>Semiconductor Sales Increase 13.7% in 2018 </p>
<p>The Semiconductor Industry Association (SIA) announced the global semiconductor industry posted sales of $468.8 billion in 2018, the industry&#8217;s highest-ever annual total and an increase of 13.7% compared to the 2017 total. Global sales for the month of December 2018 reached $38.2 billion, a slight increase of 0.6% over the December 2017 total, but down 7.0% compared to the total from &#8230;</p>
<p>Global Semiconductor Sales Increase 13.7 Percent to $468.8 Billion in 2018<br />
<a href="https://www.semiconductors.org/global-semiconductor-sales-increase-13-7-percent-to-468-8-billion-in-2018/" rel="nofollow">https://www.semiconductors.org/global-semiconductor-sales-increase-13-7-percent-to-468-8-billion-in-2018/</a></p>
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	</item>
	<item>
		<title>By: Tomi Engdahl</title>
		<link>https://www.epanorama.net/blog/2017/12/29/electronics-trends-for-2018-2/comment-page-27/#comment-1624337</link>
		<dc:creator><![CDATA[Tomi Engdahl]]></dc:creator>
		<pubDate>Wed, 06 Feb 2019 14:33:46 +0000</pubDate>
		<guid isPermaLink="false">http://www.epanorama.net/newepa/?p=62280#comment-1624337</guid>
		<description><![CDATA[Inside Out—It’s All in the Positioning
https://www.electronicdesign.com/test-measurement/inside-out-it-s-all-positioning?NL=ED-003&amp;Issue=ED-003_20190201_ED-003_840&amp;sfvc4enews=42&amp;cl=article_2_b&amp;utm_rid=CPG05000002750211&amp;utm_campaign=23073&amp;utm_medium=email&amp;elq2=151104c6b2924258a137b75e7980ab03


Positioning systems are finding their way into a wide range of applications, including AR/VR. Two new developments put a spotlight on this trend.]]></description>
		<content:encoded><![CDATA[<p>Inside Out—It’s All in the Positioning<br />
<a href="https://www.electronicdesign.com/test-measurement/inside-out-it-s-all-positioning?NL=ED-003&#038;Issue=ED-003_20190201_ED-003_840&#038;sfvc4enews=42&#038;cl=article_2_b&#038;utm_rid=CPG05000002750211&#038;utm_campaign=23073&#038;utm_medium=email&#038;elq2=151104c6b2924258a137b75e7980ab03" rel="nofollow">https://www.electronicdesign.com/test-measurement/inside-out-it-s-all-positioning?NL=ED-003&#038;Issue=ED-003_20190201_ED-003_840&#038;sfvc4enews=42&#038;cl=article_2_b&#038;utm_rid=CPG05000002750211&#038;utm_campaign=23073&#038;utm_medium=email&#038;elq2=151104c6b2924258a137b75e7980ab03</a></p>
<p>Positioning systems are finding their way into a wide range of applications, including AR/VR. Two new developments put a spotlight on this trend.</p>
]]></content:encoded>
	</item>
	<item>
		<title>By: Tomi Engdahl</title>
		<link>https://www.epanorama.net/blog/2017/12/29/electronics-trends-for-2018-2/comment-page-27/#comment-1624316</link>
		<dc:creator><![CDATA[Tomi Engdahl]]></dc:creator>
		<pubDate>Wed, 06 Feb 2019 14:12:22 +0000</pubDate>
		<guid isPermaLink="false">http://www.epanorama.net/newepa/?p=62280#comment-1624316</guid>
		<description><![CDATA[Unsticking Moore’s Law
https://semiengineering.com/unsticking-moores-law/

Applied Materials’ VP looks at what’s next for semiconductor manufacturing and the impact of variation, new materials and different architectures.]]></description>
		<content:encoded><![CDATA[<p>Unsticking Moore’s Law<br />
<a href="https://semiengineering.com/unsticking-moores-law/" rel="nofollow">https://semiengineering.com/unsticking-moores-law/</a></p>
<p>Applied Materials’ VP looks at what’s next for semiconductor manufacturing and the impact of variation, new materials and different architectures.</p>
]]></content:encoded>
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