The year 2021 was strange, you can read more of it from A 2021 technology retrospective: Strange days indeed. But how strange will 2022 be? Here are some predictions for year 2022:
2022 preview: Will the global computer chip shortage ever end?
The growing demand for computer chips, used in everything from cars to fridges, has collided with the effects of the coronavirus pandemic, leading to a global shortage that is likely to continue through 2022
Read more: https://www.newscientist.com/article/2022-2022-preview-will-the-global-computer-chip-shortage-ever-end/#ixzz7GqrP1H9A
Industry Transforming In Ways Previously Unimaginable
https://semiengineering.com/industry-transforming-in-ways-previously-unimaginable/?cmid=3dedf05d-0284-497a-b015-daf7747872e6
As we look back over 2021, there have certainly been some surprises, but the industry continues to take everything in its stride.
2022 tech themes: A look ahead
https://www.edn.com/2022-tech-themes-a-look-ahead/
The continued COVID-19 question mark: The world quickly and dramatically changed. It hasn’t yet reverted to pre-pandemic characteristics, and it very likely never will. Sad but true, the pandemic isn’t even close to being over yet.
Deep learning’s Cambrian moment: Look at today’s participant-rich deep learning silicon and software market, spanning both training and inference.
The ongoing importance of architecture: As the number of transistors that it’s possible to cost-effectively squeeze onto a sliver of silicon continues to slow, what you build out of those transistors becomes increasingly critical.
Open source processors’ time in the sun: There is a burgeoning RISC-V movement. It’s likely a little-known fact to some of you, that a public domain instruction set for v2 and earlier versions of the Arm ISA exists. And both Sun (with OpenSPARC) and IBM (OpenPOWER) have also joined the open-source silicon movement.
The normalization of remote work (and the “Great Resignation’s” aftershocks): I suspect that, to at least a notable degree, we won’t ever completely return to the “way it was before.” In fact, I’d wager that having a taste of a work-from-home or “hybrid” employment lifestyle is one of the key factors behind the so-called “Great Resignation” that tech and broader media alike inform me is well underway.
The metaverse starts to stir: Perhaps we’ll look back at 2022 as the year when the crossing of the chasm started in earnest.
Autonomy slowly accelerates: 2021 was another year filled with fully autonomous car tests and premature “coming soon” pronouncements; 2022 will likely be the same.
Batteries get ever denser, ever more plentiful, and ever cheaper
Space travel becomes commonplace
Global semiconductor industry forecasts for 2022
https://www.digitimes.com/news/a20211229VL205.html
“2021 is the year that everyone remembered that chip mattered,” said Wired Magazine. So far 2022 seems likely to be another fruitful year for the semiconductor industry.
World Semiconductor Trade Statistics (WSTS) also has predicted that the global semiconductor market is projected to grow by 8.8 percent in 2022, to US$ 601 billion, driven by double-digit growth of the sensors and logic category. All regions and all product categories are expected to continue positive growth. Wafer foundry manufacturers sales likely to remain strong due to tight supply. 5G smartphone silicon content increase to drive demand for foundry service higher. Demand for digital transformation is here to stay, no sign of weakening for foundry service sales.
The COVID-19 pandemic accelerated digital transformation over the past two years. Work from home, virtual conference, and remote learning have driven up the demand for cloud computing, laptops, and servers, and hence the sales growth of related semiconductor products. Demands for CPU, GPU, AI accelerator (including FPGA) foundry services will remain strong in 2022 because trends such as virtual conferences, live streaming, and large capex of data centers are likely to stay. Long-term demands for customized chips in IoT, 5G infrastructure, HPC, and EV applications, like ADAS, autonomous driving, V2X, in-Vehicle Infotainment, will provide robust growth momentum for chip foundry services.
Chip crunch is not ending in 2022, as the lead time of some electronic components is stretching into 2023. Meanwhile, the increasing adoption of RISC-V open standard instruction set architecture is an important trend that can not be ignored. RISC-V market will double its size in 2022, compared to 2021, as it is attracting small and medium-size chip designers and manufacturers, especially those in China. RISC-V designs are now being used by Qualcomm, Samsung, Google, Microchip, Nvidia, and more.
Taiwan’s chip industry emerges as a battlefront in US-China showdown
https://www.taipeitimes.com/News/editorials/archives/2022/01/01/2003770517
The country dominates production of chips used in almost all civilian and military technologies. That leaves the US and Chinese economies reliant on plants that would be in the line of fire in an attack on Taiwan. The vulnerability is stoking alarm in Washington
40 prosenttia pienempiä latureita
https://etn.fi/index.php?option=com_content&view=article&id=12981&via=n&datum=2021-12-20_14:53:12&mottagare=30929
The size of a standard mobile phone charger can be reduced by up to 40 percent when using GaN components or it can be designed to produce more power in the same size. GaN chargers are becoming the most popular charger technology for billions of devices, so it’s no wonder that European semiconductor giant STMicroelectronics is also excited about them.
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Tomi Engdahl says:
Financial Times:
A look at TSMC’s struggles to recruit US workers to build its chip factories in Arizona, planned to open in 2024, as Intel faces similar issues
https://www.ft.com/content/a369987e-1113-45ed-98b1-3dbf01f457ec
Tomi Engdahl says:
https://www.uusiteknologia.fi/2022/06/09/lisatty-todellisuus-tulee-tietotekniikan-korjaamiseen/
Tomi Engdahl says:
Ryan Smith / AnandTech:
AMD updates its Zen architecture roadmap, including Zen 4 improvements in 2022 and Zen 5 in 2024 with a mix of 4nm and 3nm processes and AI and ML optimizations — Today is AMD’s Financial Analyst Day, the company’s semi-annual, analyst-focused gathering. While the primary purpose …
AMD Zen Architecture Roadmap: Zen 5 in 2024 With All-New Microarchitecture
by Ryan Smith on June 9, 2022 4:21 PM EST
https://www.anandtech.com/show/17439/amd-zen-architecture-roadmap-zen-5-in-2024-with-allnew-microarchitecture
Kicking off FAD 2022 with what’s always AMD’s most interesting update is the Zen architecture roadmap. The cornerstone of AMD’s recovery and resurgence into a competitive and capable player in the x86 processor space, the Zen architecture is the basis of everything from AMD’s smallest embedded CPUs to their largest enterprise chips. So what’s coming down the pipe over the next couple of years is a very big deal for AMD, and the industry as a whole.
Zen 4: Improving Performance and Perf-Per-Watt, Shipping Later This Year
Diving right in, AMD is currently in the process of ramping up their Zen 4 architecture-based products. This includes the Ryzen 7000 (Raphael) client CPUs, as well as their 4th generation EPYC (Genoa) server CPUs. Both of these are due to launch later this yea
We’ve seen bits and pieces of information on Zen 4 thus far, most recently with the Ryzen 7000 announcement at Computex. Zen 4 brings new CPU core chiplets as well as a new I/O die, adding support for features such as PCI-Express 5.0 and DDR5 memory. And on the performance front, AMD is aiming for significant performance-per-watt and clockspeed improvements over their current Zen 3-based products.
Meanwhile, AMD is following up that Computex announcement by clarifying a few things. In particular, the company is addressing questions around Instruction per Clock (IPC) expectations, stating that they expect Zen 4 to offer an 8-10% IPC uplift over Zen 3. The initial Computex announcement and demo seemed to imply that most of AMD’s performance gains were from clockspeed improvements, so AMD is working to respond to that without showing too much of their hand months out from the product launches.
Coupled with that, AMD is also disclosing that they’re expecting an overall single-threaded performance gain of greater than 15% – with an emphasis on “greater than.” ST performance is a mix of IPC and clockspeeds, so at this point AMD can’t get overly specific since they haven’t locked down final clockspeeds. But as we’ve seen with their Computex demos, for lightly threaded workloads, 5.5GHz (or more) is currently on the table for Zen 4.
Finally, AMD is also confirming that there are ISA extensions for AI and AVX-512 coming for Zen 4. At this point the company isn’t clarifying whether either (or both) of those extensions will be in all Zen 4 products or just a subset – AVX-512 is a bit of a space and power hog, for example – but at a minimum, it’s reasonable to expect these to show up in Zen 4 server parts.
AMD will be producing three flavors of Zen 4 products. This includes the vanilla Zen 4 core, as well as the previously-announced Zen 4c core – a compact core that is for high density servers and will be going into the 128 core EPYC Bergamo processor. AMD is also confirming for the first time that there will be V-Cache equipped Zen 4 parts as well – which although new information, does not come as a surprise given the success of AMD’s V-Cache consumer and server parts.
At this point, AMD is expecting to see a >25% increase in performance-per-watt with Zen 4 over Zen 3 (based on desktop 16C chips running CineBench). Meanwhile the overall performance improvement stands at >35%
Zen 5 Architecture: All-New Microarchitecture for 2024
Meanwhile, carrying AMD’s Zen architecture roadmap into 2024 is the Zen 5 architecture, which is being announced today. Given that AMD isn’t yet shipping Zen 4, their details on Zen 5 are understandably at a very high level. None the less, they also indicate that AMD won’t be resting on their laurels, and have some aggressive updates planned.
The big news here is that AMD is terming the Zen 5 architecture as an “All-new microarchitecture”. Which is to say, it’s not merely going to be an incremental improvement over Zen 4.
In practice, no major vendor designs a CPU architecture completely from scratch – there’s always going to be something good enough for reuse – but the message from AMD is clear: they’re going to be doing some significant reworking of their core CPU architecture in order to further improve their performance as well as energy efficiency.
As for what AMD will disclose for right now, Zen 5 will be re-pipelining the front end and once again increasing their issue width. The devil is in the details here, but coming from Zen 3 and its 4 instruction/cycle decode rate, it’s easy to see why AMD would want to focus on that next – especially when on the backend, the integer units already have a 10-wide issue width.
Meanwhile, on top of Zen 4’s new AI instructions, Zen 5 is integrating further AI and machine learning optimizations. AMD isn’t saying much else here
AMD expects the Zen 5 chip stack to be similar to Zen 4 – which is to say that they’re going to have the same trio of designs: a vanilla Zen 5 core, a compact core (Zen 5c), and a V-Cache enabled core. For AMD’s customers this kind of continuity is very important, as it gives customers a guarantee that AMD’s more bespoke configurations (Zen 4c & V-Cache) will have successors in the 2024+ timeframe.
Finally, AMD has an interesting manufacturing mix planned for Zen 5. Zen 5 CPU cores will be fabbed on a mix of 4nm and 3nm processes, which unlike the 5nm/4nm mix for Zen 4, TSMC’s 4nm and 3nm nodes are very different. 4nm is an optimized version of 5nm, whereas 3nm is a whole new node. So if AMD’s manufacturing plans move ahead as currently laid out, Zen 5 will be straddling a major node jump.
Wrapping things up, the Zen 5 architecture is slated for 2024. AMD isn’t giving any further information on when in the year that might be
Tomi Engdahl says:
Ryan Smith / AnandTech:
AMD’s upcoming RDNA 3 GPU architecture will use a chiplet design and target a 50%+ performance-per-watt uplift versus RDNA 2; the first chips are coming in 2022
AMD RDNA 3/Navi 3X GPU Update: 50% Better Perf-Per-Watt, Using Chiplets For First Time
by Ryan Smith on June 9, 2022 4:39 PM EST
https://www.anandtech.com/show/17444/amd-rdnanavi-3x-update-50-better-perfperwatt-using-chiplets-for-first-time
Tomi Engdahl says:
Wall Street Journal:
TSMC and Samsung are grappling with a manufacturing equipment shortage; analyst: shortfalls of the most advanced chips could be as high as 20% by 2024 and later
Chip Shortage Threatens Cutting-Edge Tech Needed for Next-Generation Smartphones
TSMC and Samsung are grappling with technological hurdles and a shortfall in manufacturing equipment
https://www.wsj.com/articles/supply-crunch-looms-for-worlds-most-cutting-edge-chips-11654777800?mod=djemalertNEWS
The two-year global semiconductor shortage is threatening to spread to some of the most advanced chips needed for next-generation smartphones and the data centers that power apps.
Chips with the tiniest transistors and highest performance had largely escaped the drought that has hit the auto industry and other electronics. Now, problems ranging from production hitches to a shortage of manufacturing equipment have raised concerns over the ability of the world’s two highest-end chip manufacturers to meet delivery promises to customers.
The challenges could ripple through the electronics supply chain as soon as next year, with one analyst warning of shortfalls as high as 20% for the most advanced chips by 2024 and beyond. Without improved chips, technologies such as high-performance computing, artificial intelligence and more evolved forms of autonomous driving might see a slowdown in deployment, industry analysts say.
Part of the problem is that just two companies—Taiwan Semiconductor Manufacturing Co. and Samsung Electronics Co.—are capable of building the industry’s most cutting-edge chips because of the high costs and technical barriers. Both have ambitious road maps in the coming months.
Some of TSMC’s TSM -2.80% customers, however, received warnings that the company might not be able to increase production next year and in 2024 as quickly as hoped because of issues with acquiring manufacturing equipment, according to a person familiar with the situation.
Chip-manufacturing equipment is increasingly arriving later than expected, and lead times on new orders have stretched to in some cases two or three years, largely due to a dearth of less-advanced chips.
Then there are the technical issues. The contract-manufacturing unit of Samsung, the world’s second-largest contract chip maker, has experienced some capacity constraints. The Suwon, South Korea-based company saw slower-than-expected improvements in yields of chips made using the 4-nanometer process
Due to the low yields, Samsung was unable to supply as many chips as promised this year, prompting key customers including Qualcomm Inc. and Nvidia Corp. to place orders for their next-generation products with rival TSMC instead, people familiar with the matter said.
Both TSMC and Samsung say they are making progress on efforts to avoid any disruption.
Asked about TSMC’s production of its latest 3-nanometer chips in a call with analysts in April, Chief Executive C.C. Wei said that the company had issues with manufacturing-tool deliveries that it was working through.
“We’re working on 2023 right now, and we hope that we won’t have any big issue,” he said.
Samsung experienced delays in ramping up yields of its 4-nm processes, but the company is now “back on the expected yield improvement curve,” Kang Moon-soo, executive vice president of Samsung’s foundry business, said in a call with analysts last month. Samsung has said that it is on schedule to start mass production of the world’s first 3-nm chips using a novel transistor architecture by this month.
Any market concerns regarding the foundry business are excessive and unfounded, Mr. Kang said during the call.
Much of the equipment TSMC needs is also used for manufacturing older-style chips and has been in high demand, including from China. Some chip makers want equipment manufacturers to de-prioritize Chinese customers to more quickly meet their needs
Earlier this year, the company had discussions about obtaining more equipment from ASML Holding NV, one of the people said. ASML makes a range of crucial machinery for manufacturing the most advanced chips.
An ASML spokesman said demand for the company’s systems currently outstrips its ability to fulfill orders, which it is trying to address by helping customers get more output from existing tooling and other measures.
There is a mismatch in the amount of money advanced chip companies hope to spend expanding their production and the projected sales of the manufacturing-equipment industry. Chip equipment, which comprises most of the cost of setting up new chip factories, is expected to generate around $107 billion of sales globally this year, according to industry group SEMI. But planned capital expenditures by chip makers is projected to be more than that, at $180 billion, according to chip consulting firm International Business Strategies Inc.
The impact of high demand and equipment shortages on even more advanced 3-nanometer and 2-nanometer production will be significant, said Handel Jones, chief executive of IBS. He estimates a potential 10% to 20% supply shortage in that area in 2024 and 2025.
Chip-design companies that depend on contract chip makers have warned of technology and manufacturing-related risks that could affect their business down the road.
Tomi Engdahl says:
Paul Alcorn / Tom’s Hardware:
Intel claims its Intel 4 node, its first to use EUV lithography, offers 21.5% higher frequencies or 40% power reduction vs Intel 7, up to 2x transistor density
Intel Debuts Meteor Lake Die, ‘Intel 4′ Node: 20% Higher Clocks at Same Power, 2X Area Scaling
https://www.tomshardware.com/news/intel-debuts-meteor-lake-die-intel-4-node-20-higher-clocks-at-same-power-2x-area-scaling
Intel announced the first details of its ‘Intel 4′ process node and shared an image of a Meteor Lake compute die at the 2022 IEEE VLSI Symposium. Intel claims impressive results with its new ‘Intel 4′ node over its previous-gen ‘Intel 7′ node, including 21.5% higher frequencies at the same power, or a 40% power reduction at the same frequency. Intel also claims a 2X area scaling improvement, meaning it has doubled transistor density for the high-performance libraries. The Intel 4 node is also the company’s first to use EUV lithography. That’s just to name a few among many other notable advancements that we’ll cover in more detail below.
Intel’s missteps with the 10nm process saw it lose its process tech leadership to TSMC, not to mention cede performance leadership to AMD in the CPU market. As such, all eyes are on the company as its ‘Intel 4′ process, which we’ll refer to as ‘I4,’ comes to market in 2023.
Last time, Intel tried to scale too aggressively with its 10nm node and reach a 2.7X scaling goal. That led to constant delays due to the incorporation of multiple new technologies simultaneously, some of which obviously didn’t meet development targets. For I4, intel is taking a more modular approach and introducing newer technologies step by step as it progresses from node to node, thus helping it achieve a more gradual cadence that it hopes will avoid the delays we’ve seen in the past.
Tomi Engdahl says:
Mark Gurman / Bloomberg:
WWDC22 analysis: Stage Manager is a confusing mess, clues about an upcoming AR/VR headset, CarPlay’s new interface as a precursor to an Apple car, and more — The next-generation CarPlay interface is a precursor to an eventual Apple-designed Tesla rival. Also: Apple’s flawed new multitasking system …
Apple’s New CarPlay Is the Foreshock to Releasing Its Own Vehicle
https://www.bloomberg.com/news/newsletters/2022-06-12/apple-s-aapl-ios-16-carplay-is-precursor-to-apple-car-wwdc-2022-recap-l4bczhc6
The next-generation CarPlay interface is a precursor to an eventual Apple-designed Tesla rival. Also: Apple’s flawed new multitasking system, what it means that the company’s tvOS was missing in action at WWDC 2022, and how the event was full of clues about an upcoming AR/VR headset.
Tomi Engdahl says:
What’s Behind the Rise of Private Cellular Networks?
May 30, 2022
Private cellular networks offer many advantages compared to other private network solutions such as LoRaWAN and Wi-Fi.
https://www.electronicdesign.com/technologies/communications/video/21241777/electronic-design-whats-behind-the-rise-of-private-cellular-networks?utm_source=EG+ED+Connected+Solutions&utm_medium=email&utm_campaign=CPS220606004&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
What you’ll learn
What is a private cellular network?
Where are private cellular networks used?
How to get starting building a private cellular network.
Can private and public cellular networks coexist?
Cellular technology offers many features such as low latency and high throughput. In the private space, the Citizens Broadband Radio Service (CBRS), also known as private cellular, brings these features to companies that might otherwise deploy technologies like Wi-Fi (Fig. 1). There are advantages to all of these wireless technologies, and many companies and environments can benefit from more than one.
Cellular network service providers normally employ licensed spectrum for their offerings
Deploying a cellular network tends to be more expensive than some alternatives because of the hardware involved and the coverage that’s necessary. It may also include sublicensing spectrum depending on details like the area of deployment. The cost may actually be lower as this also depends on the bandwidth and latency required for an application.
The technology employed with private cellular networks is essentially the same as for providers of licensed spectrum. It’s also possible for end nodes to support private as well as public cellular networks switching between them as necessary. A typical scenario might be trucks that operate within a company’s property with a switch to a public network as a vehicle leaves this area.
Private cellular planning and deployment is similar to deploying a large Wi-Fi network, but the considerations and details tend to be different. Likewise, companies and developers need to examine the advantages and tradeoffs of private cellular networks to make sure they meet the needs of a particular application.
Tomi Engdahl says:
70 Years of Semiconductors
April 25, 2022
A brief glimpse at semiconductor history, from SCRs and TRIACs to NVIDIA’s 80-billion-transistor Hopper GPU.
https://www.electronicdesign.com/blogs/altembedded/article/21239193/electronic-design-70-years-of-semiconductors
Tomi Engdahl says:
The Evolution of Ethernet
May 4, 2022
Venerable Ethernet provides the backbone of the internet.
https://www.electronicdesign.com/blogs/altembedded/article/21240842/electronic-design-the-evolution-of-ethernet
Tomi Engdahl says:
https://www.electronicdesign.com/power-management/video/21241837/electronic-design-pcim-2022-shows-the-state-of-the-power-electronics-industry
Tomi Engdahl says:
https://etn.fi/index.php/13-news/13710-maailman-nopein-dram-siirtaeae-163-fullhd-elokuvaa-sekunnissa
HBM eli High Bandwidth Memory on DRAM-piirien tekniikka, jossa samaan väylään liitetään useita päällekkäin olevia DRAM-siruja. SK Hynix on nyt toimittanut Nvidialle ensimmäiset HBM3-muistit. Ne ovat maailman suorituskykyisimpiä DRAM-muisteja.
Tomi Engdahl says:
Racing Drones for Fun and Profit
May 18, 2022
Draganfly, one of the longest-running drone companies, announced a multi-year partnership with the Drone Racing League. The DRL’s races are broadcast to millions of fans around the world. Draganfly CEO Cameron Chell shares details about this new venture.
https://www.electronicdesign.com/markets/automotive/article/21242110/electronic-design-racing-drones-for-fun-and-profit?utm_source=EG+ED+Auto+Electronics&utm_medium=email&utm_campaign=CPS220526053&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
What you’ll learn
What’s up with the Drone Racing League.
What is the difference between a racing drone and a regular drone?
How Draganfly has developed a “safe and sustainable” drone solution.
Drones are incredibly versatile. In addition to providing effective and sustainable solutions to a number of industries, unmanned aerial vehicles (UAVs) also are being used for sport.
Draganfly, one of the longest-running drone companies in the world, recently announced a multi-year partnership with the Drone Racing League (DRL), which is the world’s premier, professional drone racing property. DRL’s broadcasted races currently reach millions of fans around the world who love watching experienced pilots make hairpin turns through multiple gates as they navigate their drone toward the finish line.
Tomi Engdahl says:
EPYC CPUs Target Edge and Data-Center Tasks
June 14, 2022
AMD’s latest server processors come in four versions that address everything from embedded edge applications to AI and networking in the cloud
https://www.electronicdesign.com/technologies/embedded-revolution/video/21244109/electronic-design-epyc-cpus-target-edge-and-datacenter-tasks?utm_source=EG+ED+Connected+Solutions&utm_medium=email&utm_campaign=CPS220608007&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
AMD’s latest servers include a suite of four families that target the cloud as well as edge server computing. AMD’s Dan McNamara presents this new platform in the video that’s summarized here.
The new families are code-named Genoa, Bergamo, Genoa-X, and Siena (Fig. 1). The latter targets edge computing with a lower core count, but it has lower power requirements as well. They’re all based on AMD’s latest 5-nm, Zen 4 core that’s also used on mobile and desktop processors. One of the main differences is the server chips have more bandwidth and cores along with acceleration that suits server applications.
Genoa pushes bandwidth and cloud flexibility with Compute Express Link (CXL) support for memory (Fig. 2). CXL allows for aggregation of memory and storage so that it can be allocated across the cloud. It’s based on PCI Express (PCIe) and the chips support PCIe Gen 5. Direct access memory is handled via a dozen DDR5 channels. It supports up to 96 Zen 4 cores.
Bergamo takes a slightly different approach to the cloud with up to 128 Zen 4C cores. The Zen 4C has the same microarchitecture as the Zen 4, but it’s optimized for size and power. Bergamo is fully compatible with the the other Zen cores.
We will have to wait until 2023 for Genoa-X and Siena, which is too bad for embedded developers because the Siena looks very interesting for server-based edge and telecommunications applications (Fig. 4).
Tomi Engdahl says:
Mikro-ohjainten myynti kiihtyi uuteen ennätykseen
https://etn.fi/index.php/13-news/13725-mikro-ohjainten-myynti-kiihtyi-uuteen-ennaetykseen
Mikro-ohjaimia myytiin viime vuonna 20,2 miljardilla dollarilla. Tutkimuslaitos IC Insightsin mukaan ennätyslukemat perustuivat 27 prosentin kasvuun. Viiden suurimman valmistajan osuus markkinoista on jo 82 prosenttia.
Suuri osa mikro-ohjainten uudesta kasvusta johtuu sulautetusta automaatiosta ja antureiden leviämisestä. Kova kysyntä oli avaintekijä siihen, että toimittajat eivät kyenneet pysymään vuoden 2021 voimakkaan elpymisen tahdissa edellisvuoden koronapandemian aiheuttamasta taantumasta, tutkimuslaitos perustelee.
Vuonna 2019 MCU-myynti pieneni 7 prosenttia ja seuraavana vuonna kaksi prosenttia lisää. Viime vuonna suunta kääntyi ja kasvu oli nopeinta sitten vuoden 2000. Kaikkiaan markkinoille toimitettiin vuonna 2021 noin 31,2 miljardia mikro-ohjainta.
Viiden suurimman mikro-ohjaintoimittajan asemat pysyivät viime vuonna lähes ennallaan. XNP oli suurin 3,8 miljardin dollarin MCU-myynnillä ja 18,8 prosentin markkinaosuudella. Microchip yksi lähes 3,6 miljardiin dollariin ja 17,8 prosentin markkinaosuuteen. Heti perässä tulivat Renesas ja STMicroelectronics noin 17 prosentin markkinaosuudella. Kvintetin täydentää Infineon 11,8 prosentin markkinaosuudellaan.
Tomi Engdahl says:
Maailman pienin GPS-moduuli sopii 4,5 x 4,5 millimetriin
https://etn.fi/index.php/13-news/13729-maailman-pienin-gps-moduuli-sopii-4-5-x-4-5-millimetriin
Sveitsiläinen u-blox tunnetaan sekä paikannus- että mobiiliverkon moduulien kehittäjänä. Nyt yhtiö on esitellyt maailman pienimmän GPS-moduulin. MIA-M10-moduuli sopii vain 4,5 x 4,5 millimetrin tilaan.
Erittäin vähätehoiselle GNSS-alustalle rakennettu MIA-M10 tarjoaa tehokkaimman ratkaisun pientä kokoa edellyttäville paikannusratkaisuille. Moduuli on tarkoitettu paitsi kulutuselektroniikan laitteisiin myös lemmikkieläinten seurantaan, sekä teollisuusantureille.
MIA-M10 on noin puolet kilpailevia GPS-vastaanottimia pienempi. Moduuli tarjoaa erittäin alhaisen virrankulutuksen tinkimättä GNSS-suorituskyvystä. Lisäksi sen virransäästötilat voivat kaksinkertaistaa akun käyttöiän tasapainottamalla optimaalisesti paikannustarkkuutta ja virrankulutusta.
Kuten kaikki u-blox M10 -moduulit, MIA-M10 vastaanottaa samanaikaisesti neljää GNSS-signaalia (GPS, Galileo, BeiDou ja GLONASS). Vastaanottimen herkkyys takaa tarkan paikkatiedon myös pienillä antenneilla varustetuissa laitteissa, myös vaikeissa kaupunkiolosuhteissa.
Moduuli tukee u-blox inAssistNow-palvelua, joka toimittaa kiertoratatietoja Internetin kautta. Tämä lyhentää aikaa, joka MIA-M10:ltä kuluu alkusijainnin määrittämiseen käynnistettäessä: se voi seurata satelliitteja välittömästi ilman, että sen tarvitsee odottaa hidasta satelliittidatan latausta.
Tomi Engdahl says:
NXP unveils MCX general-purpose Arm MCU family with 30x faster machine learning performance
NXP has announced a new MCX general-purpose Arm Cortex-M MCU family designed for advanced industrial and IoT edge computing and integrating an NXP neural processing unit (NPU) capable of delivering over 30 times higher performance than running the AI inference tasks on an Arm Cortex-M33 core alone.
https://www.cnx-software.com/2022/06/14/nxp-mcx-general-purpose-arm-mcu-family-30x-faster-machine-learning-performance/
Tomi Engdahl says:
Apple will allow Linux VMs to run Intel apps with Rosetta in macOS Ventura
You can even use Rosetta with non-Apple Arm CPUs, though you probably shouldn’t.
https://arstechnica.com/gadgets/2022/06/macos-ventura-will-extend-rosetta-support-to-linux-virtual-machines/
Tomi Engdahl says:
Intel offers ‘server on a card’ reference design for network security
OEMs thrown a NetSec Accelerator that plugs into server PCIe slots
https://www.theregister.com/2022/06/08/intel_security_reference_design/
Tomi Engdahl says:
Intel 4 process might enable 20 percent higher clock speeds with identical power consumption
A massive leap over Intel 7
https://www.techspot.com/news/94915-intel-4-process-might-enable-20-percent-higher.html
A Twitter user leaked a few slides from Intel’s upcoming presentation at the IEEE VLSI Symposium 2022 before deleting them a few hours later. The slides detail the new Intel 4 process node and contain a die shot of an unreleased Meteor Lake-P processor. As a reminder, Intel expects to release its 14th-gen Meteor Lake CPUs in late 2023, following the release of Raptor Lake this year.
The Intel 4 node will reportedly make extensive use of EUV lithography. The chipmaker also claims that it can achieve almost twice the high-performance library area scaling compared to the Intel 7 process used in current Alder Lake processors. The new node will also be compatible with the company’s EMIB and Foveros packaging technologies, with the latter being used for Meteor Lake to enable a tiled design. Most notably, Intel is aiming for at least 20 percent higher clock rates at the same power consumption as Intel 7, meaning we could see high-end desktop CPUs reaching 6 GHz.
Meteor Lake 6+8 pic.twitter.com/c1JwWuCJRu
— witeken (@witeken) June 11, 2022
The leaked die shot is of the compute tile of a 14th-gen Meteor Lake-P mobile chip. It features 6 P-cores and 8 E-cores, and it utilizes the previously mentioned Intel 4 node. The CPU will also feature an I/O tile, SOC tile, and graphics tile, with the latter expected to use TSMC’s N3 process. Previous rumors indicate the desktop CPUs will require a new LGA 1851 socket, not LGA 2551.
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Tomi Engdahl says:
Valtio toteutti it-hankkeen agile-menetelmillä – kesti yli 12 vuotta, budjetti triplaantui
Aleksi Kolehmainen13.6.2022 14:28|päivitetty13.6.2022 21:17Ketterät menetelmätJulkisen hallinnon ict
Vankiloiden uuden tietojärjestelmän kimpussa on ehtinyt työskennellä hankkeen 12 vuotta kestäneen toimikauden aikana kolme eri it-toimittajaa. 40 miljoonaa euroa maksanut järjestelmä otettiin viimein käyttöön tänä vuonna, mutta sen vaikeudet jatkuvat.
Tomi Engdahl says:
Valtio toteutti it-hankkeen agile-menetelmillä – kesti yli 12 vuotta, budjetti triplaantui
Aleksi Kolehmainen13.6.2022 14:28|päivitetty13.6.2022 21:17Ketterät menetelmätJulkisen hallinnon ict
Vankiloiden uuden tietojärjestelmän kimpussa on ehtinyt työskennellä hankkeen 12 vuotta kestäneen toimikauden aikana kolme eri it-toimittajaa. 40 miljoonaa euroa maksanut järjestelmä otettiin viimein käyttöön tänä vuonna, mutta sen vaikeudet jatkuvat.
https://www.tivi.fi/uutiset/valtio-toteutti-it-hankkeen-agile-menetelmilla-kesti-yli-12-vuotta-budjetti-triplaantui/ee8112b5-f343-4bac-91bb-e5402dc5f558
Tomi Engdahl says:
AMD Announces Genoa-X: 4th Gen EPYC with Up to 96 Zen 4 Cores and 1GB L3 V-Cache
https://www.anandtech.com/show/17438/amd-genoax-4th-gen-epyc-with-up-to-96-zen-4-cores-coming-in-2023
As AMD makes strides in snatching market share with its high-performance x86 processor designs in the server market, it has announced some of its upcoming 4th generations EPYC families expected sometime in 2023. Focusing on its technical computing and database-focused family codenamed Genoa-X, it is the direct successor to AMD’s Milan-X EPYC line-up which launches, later on, this year in Q4.
Essentially the V-Cache enabled version of AMD’s Genoa EPYC CPUs, Genoa-X will include up to 96 Zen 4 cores and 1GB (or more) of L3 cache per socket. We know that Genoa-X will be using the latest SP5 socket (LGA6096), and will feature twelve memory channels, just like the regular Genoa platform which is set to debut in Q4 2022
Tomi Engdahl says:
https://academicpositions.com/story/shining-a-light-on-next-generation-microchips
Tomi Engdahl says:
BREAKING | TSMC says it will make ultra-advanced 2nm chips by 2025.
#TSMC #Taiwan
https://s.nikkei.com/3tFIaqG
Tomi Engdahl says:
The future of digitalization: On-premises vs. cloud
https://blogs.sw.siemens.com/xcelerator/2021/11/17/the-future-of-digitalization-on-premises-vs-cloud/?utm_source=endeavor&utm_medium=native&utm_campaign=personifai&utm_term=cloud+technology&_ref=dXRtX3NvdXJjZT1lbmRlYXZvciZ1dG1fbWVkaXVtPW5hdGl2ZSZ1dG1fY2FtcGFpZ249cGVyc29uaWZhaSZ1dG1fdGVybT1jbG91ZCt0ZWNobm9sb2d5
Recently Tosh Tambe, VP, Cloud Strategy and Transformation and Chad Jackson, Chief Analyst and CEO of Lifecycle Insights, had a conversation regarding Xcelerator as a Service and what it means for digital transformation.
This three-part series highlights their conversation and thoughts on the future of digitalization.
Tomi Engdahl says:
Digital Threads and Business Processes
https://blogs.sw.siemens.com/xcelerator/2021/08/20/digital-threads-and-business-processes/?utm_source=endeavor&utm_medium=native&utm_campaign=personifai&utm_term=digital+transformation&_ref=dXRtX3NvdXJjZT1lbmRlYXZvciZ1dG1fbWVkaXVtPW5hdGl2ZSZ1dG1fY2FtcGFpZ249cGVyc29uaWZhaSZ1dG1fdGVybT1kaWdpdGFsK3RyYW5zZm9ybWF0aW9u
Manufacturers of all stripes are pursuing digital transformation efforts to meet the evolving needs of product development. The digital thread is a vital part of such initiatives. As manufacturers look for better ways to manage more complex products and processes through digital transformation, many are formalizing and improving their digital threads.
The Comprehensive Digital Twin, Explained
The digital twin of a product consists of the definitions, documentation, and simulations that detail the form, fit, and function of every aspect of a product: every system, every assembly, and every item in a product. The same holds true of the digital twin of a plant, except that it encompasses everything in manufacturing production, spanning every operation, every cell, every line or system, and even entire facilities. For more clarity, let’s review what comprises the digital twin at a more granular level. The digital twin consists of:
system architectures, bills of materials (BOMs), and other things that represent the structure of the product or plant;
3D models, sketches, top-down-design space claims, concept models, schematics, diagrams, layouts, etc.; all of which are logical, functional, or physical representations of the product or plant;
simulations and analyses, from one-dimensional ones all the way to complex 3D ones across many engineering physics and design domains such as structures, fluids, signal integrity, human operators executing a procedure in a cell, and much more;
deliverables needed to execute operations or that describe intent, such as operator instructions, numerically controlled instructions such as toolpaths, design or configuration rules that drive sizing;
requirements, specifications, standards, test cases and plans, and other text-based documentation that don’t necessarily have a one-to-one equivalent in the physical world but still describe the product; and
data coming from simulations, physical tests, or even post-delivery product and production operation.
Overall, it is key to recognize that the digital twin is a composite representation. No single definition, documentation, or simulation alone describes even a fraction of the whole product. It is only when these aspects are understood collectively that an organization can grasp the form, fit, and function of the product or the plant.
Digital Threads, Explained
A digital thread is a discrete, linked, traceable sequence of activities in the product or production lifecycle, that is digitized and automated.
Digital threads range widely in scope and provide means to navigate fast and flexibly through all systems of record. Some are executed completely in engineering. Others run only in manufacturing. Yet others span both engineering and manufacturing. Likewise, some focus exclusively on the product. Others on the plant. Some span both. And still others connect products in operation/service with key areas of product development.
Examples of digital threads include:
the system engineering flow that defines requirements or specifications and breaks them down into sub-requirements, builds out functional architectures, creates physical architectures, and connects all of them together;
planning and designing a production facility where engineers shift manufacturing lines and systems while simulating material flow;
the prototype and test process where engineers assemble and integrate the first, physical version of a product to run hybrid physical-digital test cases; or
the virtual commissioning sequence where engineers digitally validate the logic of manufacturing equipment controllers for production processes.
Tomi Engdahl says:
Lifecycle Insights: Digital transformation offers overwhelming ROI
https://resources.sw.siemens.com/en-US/analyst-report-lifecycle-insights-digital-transformation-offers-overwhelming-roi?utm_source=endeavor&utm_medium=native&utm_campaign=personifai&utm_term=digital+transformation&_ref=dXRtX3NvdXJjZT1lbmRlYXZvciZ1dG1fbWVkaXVtPW5hdGl2ZSZ1dG1fY2FtcGFpZ249cGVyc29uaWZhaSZ1dG1fdGVybT1kaWdpdGFsK3RyYW5zZm9ybWF0aW9u
As today’s products become more complex, so do the processes and organizations required to support their development. Customers demand smart and connected products, regions keep implementing more regulations and industry disruption is constant. This is the reality across industries, and for everyone ranging from startups to large enterprises.
The answer to today’s complexity challenges: digital transformation. But where do you start, who does it affect, and is it worth it?
Read this exclusive benchmark report by Lifecycle Insights to learn more.
Tomi Engdahl says:
Introducing Project TinyMiniMicro Home Lab Revolution
https://www.servethehome.com/introducing-project-tinyminimicro-home-lab-revolution/
Project TinyMiniMicro is something I have wanted to look at for some time. There are a lot of home/ SMB server users out there who need large amounts of storage. Others simply need a server to run a WiFi AP controller, a VoIP solution, and a few other services/ development VMs. While there are some that need massive compute and memory footprints in single machines, there are others that prefer building smaller clusters. Project TinyMiniMicro is not for everyone, but many of our users are going to be wowed by the results. TinyMiniMicro comes from the fact that Lenovo, HP, and Dell are the primary manufacturers of these nodes and those are the tags they use respectively to indicate they are small form factor workstations.
Tomi Engdahl says:
Amazon announces its first fully autonomous mobile warehouse robot
It can pick things up, put them down, and move them around
https://www.theverge.com/2022/6/21/23177756/amazon-warehouse-robots-proteus-autonomous-cart-delivery?scrolla=5eb6d68b7fedc32c19ef33b4
Amazon has announced its “first fully autonomous mobile robot,” meant to move large carts throughout its warehouses. The robot is called Proteus, and Amazon says it can safely navigate around human employees, unlike some of its past robots that it kept separated in a caged area.
Amazon says Proteus robots have “advanced safety, perception, and navigation technology,” and a (strangely silent) video shows the robots shining a green light in front of themselves as they move around. When a human steps into the beam, the robot stops moving, then resumes after the person moves away.
Tomi Engdahl says:
AMD:n uusin tuo lisää tehoa konenäköön
https://etn.fi/index.php/13-news/13745-amd-n-uusin-tuo-lisaeae-tehoa-konenaekoeoen
Tomi Engdahl says:
Uusi irrotettava muistikortti esillä Nürnbergissä
https://etn.fi/index.php/13-news/13744-uusi-irrotettava-muistikortti-esillae-nuernbergissae
Uusia sulautettuja muistikortteja tulee markkinoille varsin harvoin, mutta nyt Nürnbergin Embedded World -näyttelyssä nähdään sellainen. Kioxia esittelee messuilla ensimmäistä PCIe-väyläistä XFMEXPRESS-korttia. XMF tuo laitteisiin erittäin pienikokoisen irrotettavan muistin, jolla on kova suorituskyky.
XFMEXPRESS on yhdistelmä pientä kokoa, nopeutta ja huollettavuutta, ja tarkoitettu erityisesti seuraavan sukupolven mobiili- ja sulautettuja sovelluksia.
Kioxian XT2 on ensimmäinen tuote, joka täyttää JEDEC-standardin vaatimukset. Kortin fyysiset mitat ovat vain 14 x 18 x 1,4 millimetriä
NVMe-ohjain juoksuttaa dataa kahden PCIe 4.0 -linjan läpi. Sulautetuissa XFEXPRESS nousseekin heti SSD:n korvaajaksi useissa sovelluksissa.
Tomi Engdahl says:
Laiteohjelmisto ja data samalle EEPROMille ensimmäistä kertaa
https://etn.fi/index.php/13-news/13743-laiteohjelmisto-ja-data-samalle-eepromille-ensimmaeistae-kertaa
Tomi Engdahl says:
Intel is claiming interest on its 2009 EU fine.
Intel really just asked the EU for $624M to pay it back for overturned anti-AMD fine
By Alan Dexter published about 21 hours ago
https://www.pcgamer.com/intel-really-just-asked-the-eu-for-dollar624m-to-pay-it-back-for-overturned-anti-amd-fine/?utm_campaign=socialflow
This battle has been ongoing since 2009 and shows no sign of abating.
Tomi Engdahl says:
Plastic CPUs Will Bend To Your Will
https://hackaday.com/2022/06/21/plastic-cpus-will-bend-to-your-will/
As microcontroller prices drop, they appear in more things. Today you will find microcontrollers in your car, your household appliances, and even kid’s toys. But you don’t see them often embedded in things that are either super cheap or have to flex, such as for example a bandage. Part of the reason is the cost of silicon chips and part of the reason is that silicon chips don’t appreciate bending. What if you could make CPUs for less than a penny out of flexible plastic? What applications would that open up? PragmatIC — a company working to make this possible — thinks it would open up a whole new world of smart items that would be unthinkable today. They worked with a team at the University of Illinois Urbana-Champaign to create prototype plastic CPUs with interesting results.
This is still the stuff of research and dreams, but a team of researchers did work to produce 4-bit and 8-bit processors using IGZO –indium gallium zinc oxide — semiconductor technology. This tech can be put on plastic and will work even if you bend it around a radius as small as a few millimeters.
The key problem, it seems, is yield. When ARM put the 32-bit M0 CPU on plastic, the yield was poor because of the high gate count. These new processors are simplified 4-bit devices that account for the 81% yield. At that yield, the devices could cost less than a penny to produce.
The First High-Yield, Sub-Penny Plastic Processor
It took a major redesign for cheap flexible chips to reach their promise
https://spectrum.ieee.org/plastic-microprocessor
For decades, hopeful techies have been promising a world where absolutely every object you encounter—bandages, bottles, bananas—will have some kind of smarts thanks to supercheap programmable plastic processors. If you’ve been wondering why that hasn’t happened yet, it’s that nobody has built working processors that can be made in the billions for less than a penny each.
It hasn’t been for want of trying; in 2021 Arm reproduced its simplest 32-bit microcontroller, the M0, in plastic, but even this couldn’t hope to meet the mark. The problem, according to engineers at the University of Illinois Urbana-Champaign and at British flexible-electronics manufacture PragmatIC Semiconductor, is that even the simplest industry-standard microcontrollers are too complex to make on plastic in bulk.
In research to be presented at the International Symposium on Computer Architecture later this month, the transatlantic team presents a simple yet fully functional plastic processor that could be made at sub-penny prices. The Illinois team designed 4-bit and 8-bit processors specifically to minimize size and maximize the percentage of working integrated circuits produced. Eighty-one percent of the 4-bit version worked, and that’s a good enough yield, says team leader Rakesh Kumar, to breach the one-penny barrier.
“Flexible electronics has been niche for decades,” says Kumar. He adds that this yield study shows “that they may be ready for the mainstream.”
The processors his team built were made using the flexible thin-film semiconductor indium gallium zinc oxide (IGZO), which can be built on plastic and continues to work even when bent around a radius of millimeters. But while a reliable manufacturing process is a prerequisite, it was the design that made the difference.
Instead of adapting an existing microcontroller architecture to plastic, Kumar’s team started from scratch to create a design called Flexicore. “Yield goes down very quickly as you increase gate count,”
Tomi Engdahl says:
Jared Newman / Fast Company:
Valve’s Steam Deck makes a brilliant case against walled gardens by running Arch Linux and allowing software from anywhere, unlike every major game console — The Steam Deck is a portable gaming system that breaks the biggest rule of gaming systems. — Unlike practically every major game …
Valve’s Steam Deck makes a brilliant case against walled gardens
https://www.fastcompany.com/90761990/steam-deck-install-apps-operating-systems
Rather than boxing you into its own store, Valve’s portable gaming system lets you install software from anywhere, and it’s glorious.
The Steam Deck is a portable gaming system that breaks the biggest rule of gaming systems.
Unlike practically every major game console that’s come before it, the Steam Deck, from PC gaming giant Valve, doesn’t lock users into one ecosystem. While Valve’s own Steam store is the default way to buy and play games, the Steam Deck also lets users install whatever software they want on the device’s Linux-based operating system.
The experience has been liberating. In recent weeks, I’ve gorged on weird indie creations from itch.io, classic games from GOG.com, and free games from the Epic Games Store. I’ve used Plexamp to stream my personal music collection in place of in-game soundtracks, and I’ve used Vivaldi to browse the web in the Steam Deck’s desktop mode. You don’t have to use your Steam Deck this way, but just being knowing that it’s an option makes the device more capable and personal.
The tech industry is filled with companies that seem deathly afraid of this model, either because they don’t trust their users or don’t want to risk weakening their own ecosystems. By taking the opposite approach, Valve is proving that open platforms aren’t so catastrophic, and it elevates the Steam Deck from yet another gadget into the most exciting consumer electronics device in years.
How Steam Deck sideloading works
Most people will never need to venture beyond the Steam Deck’s standard menu system, which offers a simple way to buy and play games from the Steam store. Valve’s PC game catalog remains unparalleled, so you could be a satisfied Steam Deck user without dipping into its desktop mode.
But if you click the “Power” menu option in Steam Deck settings and select “Switch to Desktop,” that simple interface falls away, revealing the desktop of an Arch Linux computer. This is where the Steam Deck’s possibilities really open up.
The desktop mode has its own app store based on a popular Linux software repository called Flatpak, letting you install apps such as Chrome, Discord, Slack, and Spotify. The Steam Deck also comes pre-loaded with Mozilla’s Firefox browser, which you can use to install additional software from the web.
Valve has always let users list non-Steam software in their Steam libraries, and that capability carries over to the Steam Deck as well. That means you can install a game from the desktop, add it to Steam, and then launch it through the Steam Deck’s simplified menu system instead of returning to the desktop each time.
Steam Deck users have already taken advantage of this system in clever ways. An app called Heroic Games Launcher, for instance, helps make Epic Games Store games playable on the Steam Deck—including ones made for Windows PCs—while a companion tool called Heroic Bash Launcher automatically adds those games to the Steam interface. Another program called Emudeck provides a similar service, but for classic console game emulators. You can even run alternative game launchers from desktop mode, effectively replacing the stock Steam interface.
Tomi Engdahl says:
AMD Announces Ryzen Embedded R2000 Series with Optimized Performance and Power Efficiency for Industrial, Machine Vision, IoT and Thin-Client Solutions
https://www.amd.com/en/press-releases/2022-06-21-amd-announces-ryzen-embedded-r2000-series-optimized-performance-and-power
AMD (NASDAQ: AMD) today announced the Ryzen™ Embedded R2000 Series, second-generation mid-range system-on-chip (SoC) processors optimized for a wide range of industrial and robotics systems, machine vision, IoT and thin-client equipment. Ryzen Embedded R2000 Series doubles the core count1 and delivers a significant performance uplift compared to the prior generation, with the new R2514 model exhibiting up to 81 percent higher CPU2 and graphics3 performance than the comparable R1000 series processor. Performance-per-watt efficiency is also optimized using “Zen+” core architecture with AMD Radeon graphics for rich and versatile multimedia capabilities. Ryzen Embedded R2000 processors can power up to four independent displays in brilliant 4K resolution.
Embedded R2000 Series processors are scalable up to four “Zen+” CPU cores with eight threads, 2MB of L2 cache and 4MB of shared L3 cache. This gives embedded system designers great flexibility to scale performance and power efficiencies with a single processing platform.
Tomi Engdahl says:
Avnet Announces Global Strategic Collaboration Agreement with Amazon Web Services
https://news.avnet.com/press-releases/press-release-details/2022/Avnet-Announces-Global-Strategic-Collaboration-Agreement-with-Amazon-Web-Services/default.aspx
Avnet’s IoTConnect Platform to include preconfigured and managed AWS IoT services to enable simple, fast, and secure IoT implementations for OEMs
PHOENIX–(BUSINESS WIRE)– Through a new global strategic collaboration agreement, Avnet (Nasdaq: AVT) and Amazon Web Services (AWS) are focused on helping Original Equipment Manufacturers (OEMs) of IoT solutions accelerate their time to market. This multi-year, joint investment will enable Avnet’s IoTConnect Platform to deliver the breadth and depth of AWS’ portfolio of services—creating a scalable, secure platform that preconfigures AWS’ services for application-specific usage.
Avnet’s IoTConnect Platform helps OEMs that are designing connected solutions overcome the pressures of time to market, scalability, reliability, and security. Many OEMs today are lean organizations that need to continue to invest in the resources that provide differentiated value and deliver the expertise to their market. Adding cloud-connected experiences to their product offerings often strains these organizations because IoT requires additional software, security, and cloud management skillsets. Having access to pre-integrated and abstracted capabilities that they can easily assemble and deploy can greatly accelerate their efforts and reduce overhead.
This strategic collaboration provides Avnet’s IoTConnect Platform with access to AWS’ portfolio of services, including IoT, machine learning, analytics, and compute services. Avnet customers will soon have access to an aggregated IoT development experience across AWS services, including AWS IoT Core, AWS IoT Greengrass, FreeRTOS, AWS IoT Analytics, and AWS IoT SiteWise. The collaboration between Avnet and AWS will benefit OEMs by providing: (a) Device provisioning, configuration and lifecycle management, (b) Multi-layer security, (c) Multi-protocol connectivity, (d) Integration of 3rd party services, API gateway, SDKs, (e) Business Intelligence (BI) with data monitoring, analytics and notifications, (f) Pre-built business applications. This allows OEMs to focus on the development of features and applications that truly elevate their connected products and accelerates time to market.
Tomi Engdahl says:
https://techcrunch.com/2022/06/24/startups-keep-laying-off-swaths-of-employees-as-the-downturn-continues/?tpcc=tcplusfacebook
Tomi Engdahl says:
https://techcrunch.com/2022/06/23/the-next-wave-of-supply-chain-innovation-will-be-driven-by-startups-that-help-incumbents-win/?tpcc=ecfb2020
Tomi Engdahl says:
https://techcrunch.com/2022/06/23/the-next-wave-of-supply-chain-innovation-will-be-driven-by-startups-that-help-incumbents-win/?tpcc=ecfb2020
For years, the prevailing narrative for innovation in supply chain has focused on the disruptors: Upstarts that enter the industry with new technologies and business models to displace incumbents.
Less heralded has been the next wave these disruptors often catalyze: Digital enablers seeking to arm the incumbents against the incursions of their new digital rivals.
But in verticals ranging from freight brokerage to B2B marketplaces, these enablers have repeatedly emerged after an initial disruption. For these industries, digital enablers, rather than disruptors, constitute the next wave of supply chain innovation.
Tomi Engdahl says:
https://www.edn.com/has-chinas-domestic-chip-industry-reached-an-inflection-point/
Tomi Engdahl says:
https://www.uusiteknologia.fi/2022/06/24/eurooppaan-uusi-elektroniikan-valmistusjatti/
Tomi Engdahl says:
The Beating Heart of the World’s First Exascale Supercomputer These chips power Frontier past 1,100,000,000,000,000,000 operations per second
https://spectrum.ieee.org/frontier-exascale-supercomputer
Tomi Engdahl says:
https://www.nextplatform.com/2022/06/16/meta-platforms-hacks-cxl-memory-tier-into-linux/
Tomi Engdahl says:
Voiko robottia kutsua työkaveriksi? Ihmiset ja robotit kohtaavat entistä useammin työpaikoillaan tulevina vuosina
Tuoreen väistöskirjatutkimuksen mukaan suhtautuminen roboteihin työelämässä ei ole kokonaisuudessaan kielteistä.
https://yle.fi/uutiset/3-12505135
Tomi Engdahl says:
The effects of remote work on collaboration among information workers
https://www.nature.com/articles/s41562-021-01196-4
Tomi Engdahl says:
The First High-Yield, Sub-Penny Plastic Processor It took a major redesign for cheap flexible chips to reach their promise
https://spectrum.ieee.org/plastic-microprocessor
Tomi Engdahl says:
Director of the world’s fastest supercomputer explains how they did it
Welcome to the future of computing.
https://interestingengineering.com/director-worlds-fastest-supercomputer
Tomi Engdahl says:
https://www.techradar.com/news/rip-expensive-silicon-chips-plastic-processors-are-the-future