In 2016, each person on the planet purchased an average of 111 semiconductor chips or integrated circuits.
As the number of chips climbs, so does the need for greater power, space, and cost efficiency. In response, power device manufacturers have continued to evolve silicon-based technologies and develop new, wide bandgap materials such as gallium-nitride (GaN) and silicon-carbide (SiC).
To make good development decisions, system designers must know the strengths and trade-offs of these competing power technologies.
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