10 Tips and Tricks for Hackathon Success | Adam Benzion | LinkedIn
https://www.linkedin.com/pulse/10-tips-tricks-hackathon-success-adam-benzion?published=t →
https://www.linkedin.com/pulse/10-tips-tricks-hackathon-success-adam-benzion?published=t →
https://blog.hackster.io/introduction-to-developing-a-new-wireless-product-bf0a6c5b51a4#.esxyeyiei There are two routes to incorporating wireless functionality into a custom PCB design: a self-contained module, or a chip design. In almost all cases, it’s best to start off with a module solution. Wireless functions can be one of the trickiest types of circuits to design so modules are very commonly used. →
http://spectrum.ieee.org/telecom/wireless/stages-of-electronics This article takes a view of the steps how we got from idea of first radio to modern smart phones. →
http://www.edn.com/electronics-blogs/tales-from-the-cube/4327012/Stick-to-the-schematic?_mc=sm_edn&hootPostID=f8a02d5d2d8a2361a5acbc3aa83412e8 Nice story on debugging RF circuit… “I could get any manner of triangle distortion or offset depending on where I touched. A finger presents an impedance of approximately 100 pF in series with approximately 100Ω to ground, and this condition loads and modifies oscillations” →
http://spectrum.ieee.org/tech-talk/semiconductors/processors/to-get-ai-in-everyday-gadgets-engineers-go-to-specialized-hardware Special harware is needed for implementing AI efficiently. →
http://www.edn.com/electronics-blogs/power-points/4457384/Is-make-or-buy-still-a-choice-for-AC-DC-supplies-?_mc=sm_edn&hootPostID=1b28ba0d96d2568cb24b9f76b5c56134 →
http://www.edn.com/electronics-blogs/rowe-s-and-columns/4457432/DesignCon-2017–PAM4-measurements-are-solidifying–but-remain-in-flux?_mc=sm_edn&hootPostID=c1c28a06992ea1a8e4f195f065bab546 →
http://www.edn.com/electronics-blogs/benchtalk/4443337/Adrift-on-the-meandering-path-of-product-development–DC-probe-case-study?_mc=sm_edn&hootPostID=372e3ba99cb0a2f39c96801d85c98463 →
http://www.edn.com/electronics-blogs/test-cafe/4443252/Five-test-and-measurement-predictions-for-2017?_mc=sm_edn&hootPostID=61f64b79c1bee4357e9567a038bb80c3 →
The MIPI Alliance Inc. industry consortium has just released the specification for the Improved Inter-Integrated Circuit – or I3C – a sensor interface specification. The I3C is supersets the I2C specification. I3C is aimed to streamline sensor integration in smartphones, wearables, Internet of Things (IoT) devices and automotive systems. I2C has been the most widely →